The dispute between advanced packaging equipment: domestically produced chip machine accuracy of world -class accuracy, stability second -class, and market share of three streams

At present, the accuracy and speed of domestic filming machines have reached the international front -line level, but it has maintained disadvantages in terms of stability and market share. The national rate of domestic filmmakers is 10%, and core components still need to be imported. Only by the rise of local semiconductor equipment and component manufacturers can it truly help the domestic semiconductor industry to achieve autonomous controlling and controllable.

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In the development direction of the integrated circuit electronic component towards precision micro -micro and high integration, the thickness of the wafer is thinner and thinner, the wafer size is getting larger and larger, the width, cutting groove and chip size between chips are gradually slightly shrinking. The technology put forward more harsh requirements, high stability, high accuracy, high efficiency and intelligence becomes a benchmark for the chip machine. As one of the processing equipment of the semiconductor chip process, the chip microcomputer is processed by the processing equipment of the semiconductor chip, and it is used for micro -processing such as chip, segmentation or slotting of wafers.

The wafer chip machine, or the cutting machine（Dicing Equipment），It is a high -precision device that cuts the chip using blade or laser. It is a key device for wafer cutting and WLP cutting links during semiconductors. The quality and efficiency of cutting directly affect the packaging quality and production cost of the chip. The chip machine is widely used in the cutting process of a variety of semiconductor products such as silicon -based integrated circuits, separate devices, optoelectric components, and sensors for the packaging process of automotive semiconductor.

应用环节 图源：腾盛精密

There are two types of wafers: chopping and laser cutting. Blame cutting is the most widely used cutting process, accounting for 80%of the market share. Low cost and long service life. Laser cutting belongs to non -contact processing, and the market accounts for about 20%. It is mainly suitable for thinning wafers (<100 microns). It has high precision and efficiency. 30um wafers use plasma cutting, and the plasma cutting speed is fast). The most important device of Chiclet technology cutting cores is the laser chip machine. At present, the parameter standards of the international mainstream film equipment are:

• The straightness of the X-axis, the error is controlled within 1-3UM；

• The positioning accuracy of the y -axis ≤ 2 μm；

• The repetitive positioning accuracy of the Z axis is 1 μm, as well as high accuracy and workboard accuracy；

• The average cutting speed is 600mm/s, and up to 1000mm/s；

• Working itinerary 300mm；

• The width of the cutting track is 20um。

图源：DISCO

Focus on the short pulse laser to the surface of the chip to illuminate. On a wafer, thousands of chips are connected, and there are 80um to 150um gaps (Street) adjacent. The chip machine is cut into a single chip to prepare for the lane adhesive process. As the size of the chip becomes smaller, the area occupied by STREET will become increasing properly. The blade cutting becomes very inefficient. Laser cutting can handle the STREET with almost 0. There will be some waste, but the width will be greatly reduced, so it can increase the number of nude films of each wafer.

Domestic wafer chip machine has reached the world's first -class

For a long time, the global semiconductor wafer cutting equipment market has been monopolized by Japanese capital, and the industry's import dependence is high. Future semiconductor comprehensive research institutions data: 2021 semiconductor wafer cutting equipment markets in the market of about 2 billion US dollars (US $ 500 million in the Chinese market), the global market share Japan Disco accounts for more than 70%, Tokyo Precision is 25%, the domesticization rate is 5 %; The market for semiconductor wafer cutting equipment in 2022 is about $ 1.7 billion (US $ 500 million in the Chinese market). In 2022, the three major manufacturers Disco, Tokyo Precision and Optical Technology accounted for more than 87%, Disco accounts for over 65%. Tokyo Precision is 25%, and the nationalization rate is 10%。

In recent years, the main domestic film and equipment manufacturers are benchmarking Japanese companies. Through the "China Integration Global M & A" model, it has quickly introduced the mid -to -high -end model market. The performance, accuracy, and speed of chipping machines has reached the international first -class level. The main OSAT and the main OSAT and IDM manufacturers have been introduced in batches in batches.

With the acceleration of domestic alternatives, the gradual Chinese semiconductor industry chain will become an inevitable trend. In the future, the national probability of semiconductor prediction will be increased to 15%. In the next few years, China's newly -built 12 -inch semiconductor wafer capacity will be ranked first in the world. The demand for front and rear semiconductor production equipment will be close to 30%of the world, which will bring huge development space for Chinese equipment manufacturers. The national rate will continue to increase. But at the same time, there are still four major challenges in the process of industrialization:

• While realizing the high precision of the whole machine, how to improve stability to ensure efficient and stable output；

• Due to the difference in process, how to quickly and efficiently deliver to meet customer custom needs；

• While breaking the foreign -funded monopoly market, how to change the habit of relying on imported equipment on imported equipment for a long time, and formulate personalized localized batch import service solutions to enhance the popularity and share of domestic brands；

• While increasing the national rate of the whole machine, how to achieve domestic alternatives in the core parts of the chip machine, including precision sealing and testing equipment, air spindle, machine vision system and automation control module, precision blade and consumables, laser and related optical elements.

Two major film giants in the world

The Disco of the wafer cutting machine Founded in 1937, it started with a blade consumable business. In 1975, it developed a paddling machine. It successfully entered the precision machinery and equipment market and gradually grew into the world's leader of precision cutting equipment. In 2007, the company developed a device that could use lasers for wafers, and since then laser cutting has gradually developed. Since the Creation Society, Di Siko, which provides products from more than 1,000 customers around the world, has a systematic support system from product research and development, manufacturing, trial cutting experiments to after -sales service to form a powerful Di Siko Global Network. There are 11 domestic branches.

DISCO is the world's largest manufacturer in the world，It represents the highest level of international semiconductor chip machine technology, and has always maintained its leading advantage in terms of accuracy, stability, and market share. Laser cutting is the pillar of KIRU technology that is equalized with blade cutting. Disco has poured huge heartpower in recent years. It has been applied to multiple links such as silicon wafers, wafer manufacturing, and chip packaging. Here, the introduction of processing speed and cutting composite materials such as increasing processing speed and cutting composite materials include the use of lasers for sapphire processing, invisible cutting application technology, DBG + DAF laser cutting, full laser cutting processing, and LOW-K film slot processing. The stealth cutting equipment used in chip cutting is DFL7340 (positioning accuracy of 3 μm, repeated positioning accuracy of 2 μm), DFL7341/DFL7362 (positioning accuracy of 3 μm, repeated positioning accuracy of 1 μm); DFL7160 (positioning accuracy of 3 μm, repeated positioning accuracy of 2 μm); DFL7161 (positioning accuracy of 3 μm, repeated positioning accuracy of 2 μm);

DFL7161参数 图源：DISCO

Disco's sales in 2022 increased by about 10%year -on -year to about 280 billion yen. The third consecutive fiscal year reached a record high, and its operating profit is expected to be close to 110 billion yen. Disco accounts for about 70%of the global market share of the chip machine. Its revenue from mainland China and Taiwan accounts for nearly 50%, and consumables such as scratch knives account for about 28%.

Due to the continuous growth of power semiconductor demand for electric vehicles and strong demand for some equipment, DISCO currently has continued to open its existing factory production capacity. Since 2023, Disco plans to cut/grind chip and electronic parts materials in the next 10 years in the next 10 years. The equipment production capacity will be increased to about three times at once. The new factory built in Wu City, Hiroshima County will invest 80 billion yen, and will expand production capacity in the three phases in the three -stage project depending on the demand trend. In addition, Disco also plans to obtain a land construction land near the Nagano Institute of Mino Factory (Maoyan City, Nagano Prefecture). It is planned to build a new factory in 2025. It is mainly used in power semiconductors such as electric vehicles.

Due to the strong demand for DISCO filming equipment, the Chinese sealing and testing plant has a strong backlog of orders, the highest level of ten years, but its production capacity is limited, which provides rare opportunities for domestic cutting manufacturers.

Tokyo Precision was established in 1949. It started with measuring instruments and began to develop wafer chip machines in the 1970s. In 1994, it settled in the Chinese market in the form of a representative office, accompanied by the rapid development of China's manufacturing industry and the widespread application of big data.

Tokyo Precision has made great contributions to the high-efficiency of the high-precision chip segmentation and the beginning of the semiconductor industry since the development of the first wafer cutter A-WD-75A in 1970. In 2011, the world's smallest and fastest semiconductor production line began to mass production in the world's smallest and fastest -speed chip machine AD3000T/s (1000 mm/s); 2012 began manufacturing, development and sales from Mitsubishi comprehensive materials "acquisition of precision blade business"; 2017 2017; 2017; 2017 The year cooperates with the Panasonic Factory Solutions Co., LTD.

On the basis of inheriting the development of the technology, the company has developed the AD-PLUS/AD3000T-HC in the Laser ML300EXWH (positioning accuracy of 2um, a straight line of 1.5 μm, repeated accuracy of 1 μm) and the latest FLUIDIDICS, MEChatronics, Energy Conservation technology. Plus (positioning accuracy of 2um, repeated accuracy of 1 μm, maximum speed 1000mm/s), is leading new cutting technology.

In 2023, the latest automatic laser cutting machine AL3000 has a unique laser engine, laser slotting, cutting, and at the same time to achieve high-quality and high-efficiency processing; the plasma cutting process jointly developed with Panasonic is launched to launch a plasma cutting machine APX300-DM.

激光切割机ML300EXWH 图源：ACCRETECH

At present, Uccretech has set up 13 office, 2 exhibition centers, 1 assembly factory and 1 precision laboratory in China. In order to meet the needs of customers, the company has recently established the R & D department to increase the brick -brick in order to achieve higher -end automated functions of measurement and semiconductor equipment.

Domestic queue

Guangli Technology is the leader of the local blades. The company has deep technical accumulation and product layout in cutting sliced equipment, blade consumables, and core components. Through three overseas mergers and acquisitions in the semiconductor chip machine business sector, it has quickly grown into a third -ranked semiconductor cutting chip equipment supplier in the world. The British LP, the British LP, the core part of the core component air -floating spindle industry leader LP, which has successively acquired the inventor of the semiconductor chip machine. Localized mainstream models -fully automatic double -axis 12 -inch Full automatic chip machine ADT -8230 (positioning accuracy of 3 μm, repeated positioning 1 μm,), semi -automatic double -axis wafer cutting machine ADT -6230, semi -automatic single -axis cutting Machine ADT-610 and other series of products, the company's cutting machine performance is at a world-class level, and the company's customers are covered with a wide range. The main customers are OSAT and IDM manufacturers.

ADT -8230参数 图源：光力科技

The company has established a stable cooperative relationship with domestic and foreign companies at home and abroad with Sun Moonlight, Changdian Technology, Tongfu Microelectronics, Huatian Technology, and Jiasheng semiconductor. The company's first phase of the company's construction machine industry base in Zhengzhou Airport is expected to achieve an annual production capacity of 500 domestic production capacity.

In terms of laser planning deployment, the company stated that the subsidiary Israel ADT has developed and sold laser wafer surface treatment equipment a few years ago. It is successfully applied to the customer's production line, and the domestic laser chip machine is also developing as planned.

He Research Technology is a national high -tech enterprise specializing in the research and development, production, sales and service of semiconductor precision and cutting equipment. Model), JS series fully automatic cutting all -in -one machine and other semiconductor special precision cutting equipment.

DS9260 fully automatic film machine is compatible with mainstream 8, 12 inch round wafers, multi -square packaging substrates and other processing specifications, which successfully broke the foreign monopoly of 12 -inch wafer chip equipment in the market, becoming the first domestic crystal. The large -scale production machine brands used in the field of round -cut chips have realized domestic alternatives.

DS9260划片机参数 图源：和研科技

In 2022, the JIGSAW products were launched in 2022, JIGSAW products, which is the first domestic independent design and development. Facing the precision cutting of mainstream products such as QFN, BGA, LGA, etc. in the integrated circuit industry, it can greatly improve processing efficiency and automation. The matching KIT component is currently being successfully put into production with the Suzhou Company with the Research Technology, and has successfully mass production at Changdian and other seals.

Completion of the round B financing in 2022, the financing funds will be mainly used for high -end automatic series of product research and development, 12 -inch precision film production capacity release, and the construction of new product projects of Suzhou subsidiaries. The company plans to invest 315 million. Semiconductor precision equipment production base project. In 2023, he received investment in the National Integrated Circuit Industry Investment Fund Phase II. And launched the new HG series grinding equipment, upgraded iterative JS, and DS series chip equipment for the market.

Jingchuang Advanced is a semiconductor precision cutting equipment manufacturer. It focuses on the precision cutting field of semiconductor materials. The precision chip machine and laser cutting machine are one of its core businesses. Jingchuang Advanced Team through three -dimensional simulation design technology, precision processing and thermal treatment technology of high -precision machines, multi -dimensional motion control linkage optimization technology, and geometric error software algorithm compensation technology, etc., to ensure the long -term maintenance and long -term maintenance of the whole machine and reliability.

JDV-9230 JIG SAW参数 图源：京创先进

Jingchuang advanced to achieve the independent innovation of the industrialization of 12-inch fully automatic precision chip machine. The product line has expanded to multiple semiconductor professional equipment such as JIG SAW equipment, thinning equipment, and other advanced processes. SAW, ARP9100 Panel Saw, AR3000, AR6000, AR7000, AR7200, AR8000, AR8200, AR9000 series 6-12-inch series, widely used in chips such as semiconductor integrated circuits, GPP/LED nitrogen dump Device, sound table device, MEMS and other chips are cut in production.

In March 2023, hundreds of millions of B+financing was completed. This round of financing will mainly help new technology research, development of new products, expansion of fully automatic product capacity, and marketing and brand building

As the pioneer of China's industrial laser equipment manufacturing, Great Laser is committed to providing professional processing solutions and technical support services for high -end chip manufacturing with advanced laser processing technology integration and application. In the field of wafer cutting equipment, there are automatic wafer laser slotting equipment DSI-S-GV5232 (600mm/s, processing accuracy ≤ ± 3 μm), carbonized wafer wafer modified cutting equipment DSI-S-TC9310 (processing speed 400 400 -1000mm/s, processing accuracy ± 1 μm, repeated positioning accuracy of 1 μm), suitable for SIC, GAN, LT, Ln and other wafers.

DSI-S-TC9310参数 图源：大族激光

Mai is a high -end equipment manufacturer in the field of pan -semiconductor. At present, in the field of semiconductor equipment, the company has taken the lead in the accumulation of laser technology in the field of photovoltaic fields. Focus on semiconductor pan -cutting. Laser modified cutting equipment MX-SSD2C (cutting speed can reach 1000mm/s), equipped with high-precision wafer high-precision tracking and compensation system to ensure the stability of wafer processing, suitable for silicon wafer, such as MEMS, RFID and other products The laser is changed; the laser slotting equipment MX-SLG1C is suitable for the semiconductor wafer surface of LOW-K/CMOS such as LOW-K/CMOS.

MX-SSD2C参数 图源：迈为股份

Bojing is a subsidiary of Bojie Holdings. By acquiring the core semiconductor, it is upgraded to a high -tech enterprise that specializes in the research and development, production, and sales of semiconductor material paddling equipment and accessories consumables. Successfully developed a compatible 12, 8, and 6 -inch automatic precision section equipment, constructed and improved the standard industrialized production line of the equipment. At present, it has successfully developed and mass -produced BJX3252 6, BJX3352, BJX3356, BJX63661 precision chip machine. Equipment performance The average is high international standard (a straight line is 1.5 μm. The positioning accuracy can reach 2um, and the maximum speed is 600mm/s). It can be used for IC, QFN packaging, DFN packaging, BGA packaging, LED substrate, optical optoelectronics such as IC, DFN packaging, BGA packaging, LED substrates.

BJX6366型12寸双轴精密划片机 图源：博捷芯

Dashi Technology is a high -end equipment supplier focusing on the wafer and seal testing field. It has the third -generation laser paddling machine. It mainly includes three types of equipment: seamless cutting, laser slotting, and laser invisible cutting. Seamless laser adopts Dashi Patent Light Source technology, which is 5 times the speed of traditional blades. The cut lane is less than 5um, which greatly reduces the size of the cut lane. The groove depth can achieve more than 20um, the thermal impact area is controlled within 2um, and the flatness of the slot bottom is less than 1um. Laser hidden cutting adopts infrared light source \ SLM multi -focus technology \ RTF real -time focus follow technology. The product model is DRT505FX, which can achieve high -efficiency and precision cutting of silicon carbide, wafers, optical glass, and nitride.

达仕科技隐形切割 图源：未来半导体

As a multinational company, Dashiko has a full range of one -stop marketing and service network, covering mainland China and Taiwan, Germany, the United States, Singapore, Malaysia and other places. Its laser paddling equipment is one of the most widely purchased equipment such as Changdian and other large -sealing and testing factories.

Beijing Zhongdianke is the backbone unit of scientific research and production with integrated circuit packaging equipment. The company has a fully automatic filmmaker

HP-1221/1201/808/6103/6100 series, laser chip machine JHQ-410 series. For more than ten years, the company has provided more than 1,000 equipment and other equipment for customers at home and abroad, and has made a significant contribution to the development of my country's integrated circuit industry.

JHQ-410系列 图源：中电科

Tengsheng Precision has semiconductor seal sealing and tested wafers, finished cutting/sorting plans, positioning accuracy ≤03 μm@310 mm, repeated positioning accuracy: 1 μmm, product models are available

ADS1010/1220/1210 // 2100/3200 is mainly used in circles, QFN, BGA, MEMS, SIP, PCB, EMC wire frame, glass, ceramic.

Magnesium is an innovative of manufacturing and testing equipment in the semiconductor field, and has many mature and reliable products and solutions. The positioning accuracy of the wafer cutting equipment of the wafer cutting equipment is 0.003mm/305mmz axis repetitive accuracy of 0.001mm. The representative model includes a fully automatic double main shaft wafer cutter MRS-DT260. With SIC laser cutting machine, carry FDC autofimed follow -up system, adjust the cutting position in real time, high accuracy, compatible with ± 15um tablet thick errors.

Aikoris's current core products are semiconductor chip machines and cutting overall solutions. It has mastered the design of ultra -precision grinding machine, ultra -precision air floating main shaft technology, ultra -precision detection technology, ultra -precision motion control technology, diamond sand wheel technology, etc. It is mainly used in semiconductor wafer cutting. The main equipment is SD1222/612A/1212A/1222A, which can achieve 2um, repeat the positioning of 1 μm, and the cutting speed can reach 800mm/s.

文章来源：未来半导体公众号