Light kei Electronics-Changsha Guangqi electronic Technology Co., LTD

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cutting blade
Thinning grinding wheel
Sharpening Board
Flange
Air float spindle for scribing
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Metal knife cutting blade

New type of sintering technology Extensive application areas Extremely strong cutting performance Extremely long service life A stable quality

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An electric cast machine cuts blade

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Resin knife cutting blade

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Silicon / silicon carbide wafer grinding wheel

China Grinding Wheel Company has independently developed silicon / silicon carbide wafer grinding wheels, which have been successfully applied in the grinding process of various semiconductor substrates, wafer back thinning and regenerated wafers. In view of the material characteristics and customer requirements, China Grinding Wheel has accumulated many years of experience in designing ceramic diamond grinding wheels with high cutting force and self-sharpening ability, which can greatly improve the grinding quality and processing efficiency of wafers and further reduce the manufacturing cost.

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Silicon / silicon carbide wafer grinding wheel

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Wafer Scribing Blade Sharpening Plate

Used for trimming and sharpening of dicing knives. After the new knife is installed, it needs to be sharpened to correct the shape and edge of the blade. During the dicing process, the blade needs to be sharpened regularly to ensure the blade is sharp.

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Wafer Scribing Blade Sharpening Plate

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Silicon wafer cutting machine flange tool holder

The cutter head, also known as the cutter head or flange, is a precision component that connects the air-floating spindle of the dicing machine and the cutting blade (grinding wheel). It is widely used in the cutting fields of semiconductor wafers, ceramics and LEDs. The accuracy and stability of the product under working conditions directly affects the performance of the main machine and the air-floating spindle, and affects the accuracy, efficiency and cost of the cutting products. Our Company adhere to the concept of fine manufacturing, precision matching and optimized design, and product performance is superior; specific process solutions make mass production stable and controllable; standardized management ensures quality consistency.

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Silicon wafer cutting machine flange tool holder

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A floating main axis for a cutting machine

Our floating main axis has specific properties such as low heating, low noise, low vibration, low gas consumption and high dynamic rigidity and high load capacity.

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A floating main axis for a cutting machine

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UV degumming machine

Suitable for wafer, ceramic, optical lens, LED, IC, mobile hard disk and other List of semiconductor materials of UV film degumming, UV tape degumming.

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Glass cutting tape UV film ceramic substrate UV curing tape

UV anti-adhesion film

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Professional casting quality quality casting brand

Changsha Guangqi Electronic technology Co., LTD

Changsha Guangqi Electronic Technology Co., Ltd. was established in 2011, focusing on the semiconductor and optoelectronics industry, products covering semiconductor chip manufacturing, packaging and testing; LED chip manufacturing, product packaging and lighting applications; Optical communication, 5G, high-precision optical glass processing and other fields.

Professional equipment, accessories, and consumables that provide cutting, grinding, polishing and other processes.

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Cooperation with well-known enterprises
Solve customer customization needs

Committed to the research and development, manufacturing and application of micron and nanoscale platforms, to create the core platform of precision motion.

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Go towards the new journey!

Participate in the investment of Nantong Tongpu New Materials Technology Co., Ltd., focusing on the development and manufacturing of a soft -casting knife!

Company staff development training activities!

Flying Passion, spectrum brilliant!

One article understands SIC monocrystalline substrate processing technology

SIC single crystal is a hard and crispy material. Slice processing is difficult and the grinding accuracy requirements are high. Therefore, wafer manufacturing is a long and difficult process. This article introduces several SIC single -crystal cutting processing techniques and new wafer preparation methods in recent years.

Introduction to the core process of glass substrate TGV

In the field of advanced packaging, TSV must be used in the Interposer in 2.5D packaging or 3D packaging, but many people have recently heard that the word of glass pores (TGV). The potential of glass pores (TGV) is huge, and it may be regulars in advanced packaging technology in the future. This article will briefly describe the application and development trend of glass pores (TGV) in advanced packaging.

The United States has a huge sum of money and supports three packaging technology

Source: Content compiled from nist, thank you. Today, the government of Biden Harris announced that the US Department of Commerce (DOC) is negotiating with advanced packaging research projects in Georgia, California and Arizona, investing as high as 300 million US dollars to accelerate cutting-edge technology for the semiconductor industry. Development ...

The dispute between advanced packaging equipment: domestically produced chip machine accuracy of world -class accuracy, stability second -class, and market share of three streams

At present, the accuracy and speed of domestic filming machines have reached the international front -line level, but it has maintained disadvantages in terms of stability and market share. The national rate of domestic filmmakers is 10%, and core components still need to be imported. Only by the rise of local semiconductor equipment and component manufacturers can it truly help the domestic semiconductor industry to achieve autonomous controlling and controllable.

The dispute between advanced packaging equipment: domestically produced chip machine accuracy of world -class accuracy, stability second -class, and market share of three streams

At present, the accuracy and speed of domestic filming machines have reached the international front -line level, but it has maintained disadvantages in terms of stability and market share. The national rate of domestic filmmakers is 10%, and core components still need to be imported. Only by the rise of local semiconductor equipment and component manufacturers can it truly help the domestic semiconductor industry to achieve autonomous controlling and controllable.

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0731-84014946
dicing@kinik.com.tw

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