Source: Content compiled from nist, thank you.

Today, the government of Biden Harris announced that the US Department of Commerce (DOC) is negotiating with advanced packaging research projects in Georgia, California and Arizona, investing as high as 300 million US dollars to accelerate cutting-edge technology for the semiconductor industry.Development.The expected recipients are ABSOLICS Inc., Georgia, Application Materials Company in California, and Arizona University in Arizona.

These research and investments through competitively are expected to be as high as US $ 100 million, representing the innovative efforts in the field of advanced substrates.Advanced substrates are a physical platform that allows multiple semiconductor chips to be seamlessly assembled together to achieve high bandwidth communication between chips, high -efficiency transmission of power, and emit unnecessary heat.Advanced packaging of advanced substrates means high -performance computing of artificial intelligence, next -generation wireless communication and more efficient power electronics.Such substrates have not yet been produced in the United States, but it is essential for establishing and expanding the ability of advanced domestic packaging.The US $ 300 million federal funds will be combined with the additional investment of the private sector, so that the total investment of these three projects will exceed US $ 470 million.This joint effort will help ensure that American manufacturers maintain competitiveness and continue to promote technological innovation, so that companies can gain stronger advantages in global competition.

US Secretary of Commerce Gina Raymond Dost said: "The key to the long -term competitiveness of the United States is whether we can surpass other countries in the world in terms of innovation and construction. This is why the research and development part of the 'American chip plan' is so important to us.And these proposed investment in advanced packaging highlights the work that we do to give priority to the priority to consider the semiconductor supply chain pipeline.The leadership of Vice President Harris, through these proposed investment, we have positioned the United States as a global leader in the field of design, manufacturing and packaging microelectronics. These microelectronics will promote future innovation. "

National Economic Counselor Laleblanard said: "Today's awards are crucial to ensuring that the United States' global leadership position in the semiconductor field -to ensure that the US supply chain is in a leading position from beginning to end."

The current packaging technology cannot solve the rising power consumption, the computing performance of the AI data center, and the scalability of mobile electronics.Maintaining these future industries in the United States requires all levels of innovation.The Chips National Advanced Packaging Manufacturing Plan (NAPMP) sets positive technical goals for the substrate. It is expected that these three entities will achieve or exceed these goals.Advanced substrates are the foundation of advanced packaging. It will enhance key advanced packaging technology, including but not limited to equipment, tools, craftsmanship and process integration.These projects will play a vital role in helping ensure that American innovation promotes semiconductor research and development (R & D) and the cutting -edge development of manufacturing.

Laurie E. Locascio, deputy minister of the Ministry of Commerce Standard and Technology and Director of the National Standard and Technology Research Institute, said: "Advanced packaging is important for advanced semiconductors, and advanced semiconductors are driven by emerging technologies such as artificial intelligence. The first batch of national advanced packaging manufacturing plans will promote breakthroughs and meet the key needs in the Chips For American mission, that is, to build a powerful domestic packaging industry, so that advanced node chips produced by the United States and foreign countries can be encapsulated in the United States. "

Proposed projects include：

1. Absolics, Inc .:
   

   ABSOLICS is preparing to cooperate with more than 30 partners (including academic institutions, large and small enterprises, and non -profit entities) to develop cutting -edge capabilities to completely change the manufacturing of glass core base panels. These partners have been recognized as funding in the field of glass materials and substrates. The potential funding amount is as high as US $ 100 million. Through its substrates and materials for advanced research and technology (Smart) packaging plan, Absolics aims to build a glass core packaging ecosystem. In addition to the development of the SMART packaging plan, ABSOLICS and its partners also plan to support education and labor development by introducing training, internship and certification opportunities to technical colleges, HBCU CHIPS networks and veterans programs. Through these efforts, ABSOLICS will surpass the current glass core -based panel technology and support investment in future large -scale manufacturing capabilities.

2. Application Materials Company of San Clara, California:

Application material company and a team composed of 10 collaborators are developing and expanding a subversive silicon core substrate technology for the next generation of advanced packaging and 3D heterogeneous integration. Silicon -core substrate technology for application materials may enhance the leadership of the United States in the field of advanced packaging and help catalyze the ecosystem to develop and build the next generation of energy -saving artificial intelligence (AI) and high -performance computing (HPC) system in the United States. In addition, the education and labor development plan of application materials aims to strengthen training and internship channels between US state universities and semiconductor industries.

3. Arizes, Tanpe City, Arizona State University:

Arizona State University is leading the development of the next generation of microelectronics packaging through FOWLP. The core of the plan is ASU's advanced electronics and photon core facilities. Researchers are exploring the commercial feasibility of 300 mm wafers and 600mm panel -level manufacturing. This technology has no commercial capacity in the United States. ASU's team is composed of more than 10 partners. It is led by the industry pioneer DECA Technologies. It is centered on the regional base of Microelectronics manufacturing. It consists of large and small enterprises, universities and technical colleges, and non -profit organizations. The team is located throughout the United States and has industry leaders in the fields of materials, equipment, small chip design, electronic design automation and manufacturing. ASU will establish an interconnected foundry to link the advanced packaging and labor development plan to semiconductor factories and manufacturers. ASU's education and labor development work brings industry -related training, such as trainer training, micro -evidence, and fast entry plans for working professionals. It is an indispensable part of the national center of HBCU Chips network and the development of the American Indian Enterprise Development in its labor development plan.