1.The role of sharpening board
rThe sharpening plate can replace the wafer dummy to sharpen the cutting blade
rCompared with the traditional method of using silicon wafer sharpening, it significantly improves the working efficiency of the cutting machine
rSharpen your blades in just minutes and save material costs by increasing cutting efficiency
2. Why use a sharpening board?
rThe sharpening plate can be used before using a new wafer dicing blade to improve the blade's sharpness.
rInstall new blade → sharpen blade → cut wafer
r-After the new blade has been sharpened, the raised areas on the diamond surface are smoothed.，
rThis prevents wafer cutting burrs or cracks
3. Advantages – cost saving
Compared with the traditional way of sharpening the silicon wafer cutting knife, the sharpening plate can greatly shorten the sharpening time and improve the sharpening efficiency.
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