At this year's SPIE conference, ASML's new CEO Christophe Fouquet delivered a wonderful opening/keynote speech, focusing on High Na EUV.

Obviously, High Na EUV is unlikely to be delayed like the initial EUV. We should expect it to be launched and adopted quickly, because Gao NA is more like the "upgrade" of EUV, not a brand new product.

Christophe talked about the new method of assembling and scanning instrument components at the customer, rather than assemble them at ASML, and then disassemble them and reassemble them at the customer site.

This method has been implemented for a period of time on less complicated etching tools and similar tools, but the use of high -complexity tools with high complexity is completely another thing. But it will save a lot of time and money. This will accelerate the process of High Na.

The only real difference between the conventional EUV tool and the High Na tool is the lens stack, so if you design a lens stack in the middle tool, you can replace the conventional EUV lens, High Na lens, or Hyper Na lens into the same basic tool Essence

It has a lot of generality, more cost savings, simplicity, and so on. The modular method adopted by ASML supports this method.

This will obviously help reduce costs, reduce profits and shorten the installation time.

The demonstration also mentioned that ASML has a stable 740 -watt power supply in San Diego and is expected to realize 1,000 watts of power supply.

All in all, Christov performed very well in the first public appearance after he was in charge. His overall performance is great.

The idea of the size of the mask from the 6 -inch X 6 -inch to the 6 -inch x 12 -inch idea was carefully put forward on the Spie last year. At this year's meeting, this idea was strongly supported, and many light -covering infrastructure companies participated in it. The most important one of these is ASML (Christophe). He said that the use of double -sized mask is "taken for granted" for the industry, and ASML provides great support for this change.

This is also of great significance for ASML because it helps overcome the size limit of High Na chip size. 40% of the performance improvement itself is worth converting.

Intel's Mark Phillips continued to discuss High Na themes with Christophe Fouquet. Intel is currently installed/runs two High Na systems in Portland.

Mark shows some of the very beautiful images of the two systems. These images indicate that High Na improves better than standard EUV than expected. Because of the accumulation of experience, the installation speed of the second system is faster than the first.

It is worth noting that all the infrastructure required by High Na has been in place and started to run. High Na's optical mask check has begun to run. Therefore, it can be put into production without too much auxiliary support.

Someone also asked Mark's comparison of CAR (chemical enhanced photoretheric gum) and metal oxide light -engraved glue. Mark said that CAR is currently good, but in the future, we may need metal oxide light glue. This seems to delay the demand for metal oxides (such as Lam's dry photoresal gum), making it a farther future. This is not good news for JSR or Lam.

The target insertion point is Intel 14A technology, which takes about 3 years, which is likely to be faster than expected.

（At the meeting, the only failure we heard about High Na was that it was difficult to transport the huge High Na tool from the trailer to Portland, because the trailer was bent under the extreme weight load! .)

This almost perfect installation/startup is good news for Intel, because this is the "victory" required by their execution plan, especially after the initial EUV launch speed is slow.

Compared with the rapid use of EUV, TSMC has not collected High Na for cost. We believe that TSMC may be competing with ASML more favorable conditions, which is a bit like a positioning/negotiating game.

We think they will not persist for too long, especially if Intel starts to lead a leading position in High Na tools. TSMC will have to yield and obey. TSMC has also progressed slowly in the multiplication of mask advocated by Intel, but it will eventually be obedient, because it is free performance improvement for them.

We heard that ASML's Christophe Fouquet and Anne Kelleher in Intel met at the opening of the meeting ... Perhaps to talk about their cooperative relationships in High Na's launch.

We believe that for KLA and its long -term delayed Actinic Modeling Project, some good news is about to appear, which is very needed.

We believe that this meeting is obviously very positive for the launch of High Na EUV and the overall technical progress of Moore's Law.

This is obviously good news for Intel and ASML. This is undoubtedly a good thing for Intel, because it needs to gain as much technical advantages as possible, and Gao NA may be the most critical technical change currently undergoing the industry.

This is also good news for ASML, because the company's stock price has always been unstable and under pressure. It is largely due to Chinese issues, and Chinese issues cover up greater technological progress in the high North American market.

In the larger semiconductor market, everything is related to artificial intelligence, artificial intelligence and artificial intelligence ... it is not important for others.

Because everything is carried out around artificial intelligence, the back edge is still weak.