Yingfeeling Technology Co., Ltd. announced on September 11 that it has successfully developed the world's first 300 MM nitrogen (GAN) power semiconductor wafer technology. Yingfeeling is the world's first company to master this breakthrough technology in existing and scalable large -scale production environments. This breakthrough will greatly promote the development of the GAN power semiconductor market. Compared with 200 mm wafers, the production of 300 mm wafer chips is not only technically advanced, but also due to the expansion of the diameter of the wafer. The number of chips on each wafer has increased by 2.3 times, and the efficiency is significantly improved.

  GAN -based power semiconductors are rapidly popularized in industry, automobiles, consumption, computing and communication applications, including AI system power supply, solar inverters, chargers and adapters, and motor control systems. The advanced GAN manufacturing process can improve the performance of the device and bring many benefits to the application of end customers, including higher efficiency, smaller size, lighter weight, and lower total cost. In addition, with scalability, the 300 MM manufacturing process has extremely high stability in terms of customer supply.

  Jochen Hanebeck, CEO of Yingfeeling Technology, said: "This major success is Yingfei's innovative strength and the results of the global team's efforts, which further shows our status in the GAN and power system. Breakthroughs will promote industry changes and enable us to fully tap the potential of GAN. Ling has all three related materials, namely: silicon, silicon carbide and nitride. "

    In the Power Semiconductor Wall factory, which is located in Villach, Austria, uses the integrated trial production line of existing 300 mm silicon production equipment to successfully produce 300 MM GAN wafers. Yingfeeling is playing its advantages through the existing 300 mm silicon and 200 mm GAN's mature capacity, and will also further expand GAN production capacity according to market demand. With the 300 MM GAN process technology, Yingfeeling will promote the continuous growth of the GAN market. It is estimated that by the end of 2030, the GAN market size will reach billions of dollars.

   This pioneering technical achievement demonstrates the leadership of Yingfei in the global power system and the Internet of Things semiconductor. Yingfei Ling is layout of 300 MM GAN technology to create products that are more cost -effective and can meet the full -scale needs of the customer system, in order to strengthen existing solutions and make new solutions and applications possible. In November 2024, Yingfei will show the public at Electronica for the first batch of 300 MM GAN wafers at Electronica.

  Because the manufacturing process of GAN and silicon is very similar, a major advantage of 300 MM GAN technology is that the existing 300 MM silicon manufacturing equipment can be used. Yingfei Ling's existing 300 mm silicon production line is very suitable for trial -trial reliable GAN technology, which not only speeds up the achievement, but also can effectively use capital. The full -scale production of 300 MM GAN will help the cost of GAN and silicon can be approached at the same RDS (ON) level, which means that the cost of silicon and GAN products of the same level will be flat.

  300 MM GAN is another milestone at the leadership of Yingfei Ling's strategic innovation, which will help Ying Feiling's low carbonization and digital mission.